Molecular dynamics of rapid melting in a copper-silver alloy
Abstract
A copper-silver alloy (64% Cu/36% Ag atomic ratio) is simulated by molecular dynamics. The alloy is subjected to rapid linear heating protocols from room temperature to 2100 K at several ramp rates of the order ∼K/ps. Numerical evidence for a first-order melting transition at 1.19 × 103K is observed. This elevated value is suggested to be the result of high pressures in the microscopic sample.








