Molecular dynamics of rapid melting in a copper-silver alloy
Abstract
A copper-silver alloy (64% Cu/36% Ag atomic ratio) is simulated by molecular dynamics. The alloy is subjected to rapid linear heating protocols from room temperature to 2100 K at several ramp rates of the order ∼K/ps. Numerical evidence for a first-order melting transition at 1.19 × 103K is observed. This elevated value is suggested to be the result of high pressures in the microscopic sample.
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Published
2016-08-18
Issue
Section
Poster Session PA
How to Cite
[1]
“Molecular dynamics of rapid melting in a copper-silver alloy”, Proc. SPP, vol. 34, no. 1, p. SPP-2016-PA-22, Aug. 2016, Accessed: Apr. 16, 2026. [Online]. Available: https://proceedings.spp-online.org/article/view/SPP-2016-PA-22








