Effect of hydroxyl bond formation on the adhesion improvement of a polyethylene- copper thin film system

Authors

Melissa Angelica C. Camacho Materials Science and Engineering Program, University of the Philippines Diliman
Gene Q. Blantocas National Institute of Physics, University of the Philippines Diliman
Henry J. Ramos National Institute of Physics, University of the Philippines Diliman

Abstract

Formation of hydroxyl bonds on the surface of a gas plasma treated high density polyethylene (HDPE) sheets significantly enhanced the adhesion strength of the polyethylene-copper thin film system. Surface treatments using oxygen gas plasmas at varying plasma parameters are applied in this study to identify the most effective plasma parameters that would promote the best adhesion strength. Analysis of gas plasma adulterated HDPE sheets showed best enhancement of polyethylene-copper adhesion after an oxygen gas plasma treatment for 60 minutes at 5mA discharge current. Scanning Electron Microscopy Analysis, Fourier Transform Infrared Spectroscopy and Adhesion measurements using Pull-out Force Analysis were used to measure the changes in the surface chemistry and surface topology of the HDPE sheets.

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Issue

2009: Proceedings of the 27th Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2009-PA-03

Section

Poster Session PA

Published

2009-10-28

How to Cite

[1]

MAC Camacho, GQ Blantocas, and HJ Ramos, Effect of hydroxyl bond formation on the adhesion improvement of a polyethylene- copper thin film system, Proceedings of the Samahang Pisika ng Pilipinas 27, SPP-2009-PA-03 (2009). URL: https://proceedings.spp-online.org/article/view/SPP-2009-PA-03.