Asymmetric orientation of targets for Ti-Cu-N deposition in a magnetized sheet plasma ion source

Abstract

Varying copper content for Titanium copper nitride (TiCuN) deposition is reported using asymmetrical orientation of titanium and copper sources inside the modified Magnetized Sheet Plasma Negative Ion Source (MSPNIS). This modification entails the addition of two permanent 2.2kG SmCo magnets under the targets. Copper substrates cut into 20x10x2.3 mm³ are exposed to plasma with 1:10 N₂-Ar gas ratio. Results indicate that substrates directly above the titanium target exhibited the presence of titanium element and absent otherwise. Various SEM images show the surface morphology of the samples.