Infrared emission microscope as a failure analysis tool in the localization of short and open interconnects

Authors

  • Michelle F. Bailon ⋅ PH Intel Technology Philippines, Inc.
  • Alvarado B. Tarun ⋅ PH Intel Technology Philippines, Inc.
  • Jesus Muñoz ⋅ PH Intel Technology Philippines, Inc.
  • Alexander G. Mendenilla ⋅ PH National Institute of Physics, University of the Philippines Diliman

Abstract

Product analysis or failure analysis (FA) is one of the key factors that enables semiconductor companies in achieving world-class manufacturing standards and deliverance of high quality and highly reliable products. This paper provides insight and demonstrates the usefulness and various capabilities of Infrared Emission Microscopy (IREM) technique in fault localization and defect characterization in product analysis.

SPP 2002 Proceedings Cover

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Published

2002-10-23

Issue

2002: Proceedings of the 20th Samahang Pisika ng Pilipinas Physics Congress

Section

Instrumentation and Optics

License

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How to Cite

[1]
“Infrared emission microscope as a failure analysis tool in the localization of short and open interconnects”, Proc. SPP, vol. 20, no. 1, pp. SPP–2002, Oct. 2002, Accessed: Apr. 23, 2026. [Online]. Available: https://proceedings.spp-online.org/article/view/SPP-2002-2C-04