Synthesis of amorphous Zirconium nitride films at different Ar/N2 ratios via the plasma sputter-type negative ion source
Abstract
Zirconium nitride films were deposited on stainless steel substrates using plasma sputter-type negative ion source. This allows the production of ZrN films where substrate heating is inessential and energy of ions can be modified, allowing the control of chemical composition of the film. The films were synthesized at different %N2 (10, 15, 25, 50) in the Ar and N2 gas mixture. The target potential is -300V, discharge voltage is 60V and the deposition time is two hours. The samples were characterized by XRD, and the presence of amorphous Zr3N4 was confirmed. The optimum gas ratio was determined to be 15% N2 on Ar.