Effect of atmospheric plasma treatment on the solderability of a copper sheet with Sn-Ag-Cu alloy

Authors

  • Michael Andrei C. Paguio Sciences Department, College of Arts, Sciences, and Education, FEATI University
  • Leo Mendel D. Rosario Sciences Department, College of Arts, Sciences, and Education, FEATI University
  • Marcedon S. Fernandez Sciences Department, College of Arts, Sciences, and Education, FEATI University
  • Henry J. Ramos Sciences Department, College of Arts, Sciences, and Education, FEATI University
  • Roy B. Tumlos Sciences Department, College of Arts, Sciences, and Education, FEATI University

Abstract

An atmospheric microwave plasma pen was utilized to enhance the solderability of a copper sheet with Sn-Ag-Cu alloy (lead-free) solder. The work of adhesion of test liquids (de-ionized water, glycerol, and ethylene glycol) was increased at a
treatment time of just 30 s. The contact angle of the Sn-Ag-Cu solder on the copper sheet was reduced from 53.86o to 38.46o with a treatment time of 60 s. The enhanced solderability of the copper sheet to the lead-free solder is attributed to the increased surface roughness from 313.60 to 382 nm as confirmed by atomic force microscopy.

Proceedings SPP 2013 Cover

Downloads

Published

2013-10-23

Issue

2013: Proceedings of the 31st Samahang Pisika ng Pilipinas Physics Congress

Section

Poster Session PA

License

By submitting their manuscript to the Samahang Pisika ng Pilipinas (SPP) for consideration, the Authors warrant that their work is original, does not infringe on existing copyrights, and is not under active consideration for publication elsewhere.
Upon acceptance of their manuscript, the Authors further agree to grant SPP the non-exclusive, worldwide, and royalty-free rights to record, edit, copy, reproduce, publish, distribute, and use all or part of the manuscript for any purpose, in any media now existing or developed in the future, either individually or as part of a collection.
All other associated economic and moral rights as granted by the Intellectual Property Code of the Philippines are maintained by the Authors.

How to Cite

[1]
“Effect of atmospheric plasma treatment on the solderability of a copper sheet with Sn-Ag-Cu alloy”, Proc. SPP, vol. 31, no. 1, p. SPP2013-PA-34, Oct. 2013, Accessed: Mar. 25, 2026. [Online]. Available: https://proceedings.spp-online.org/article/view/SPP2013-PA-34