Oblique angle deposition of aluminum on etched PCB substrate

Abstract

Oblique angle deposition technique was used on thermally evaporated Aluminum thin films on etched PCB substrates. Substrates were oriented at an angle of 78o from the direction of the vapor. The thin films then underwent SEM imaging and characterization through space-resolved resistance measurement and reflectance test. The SEM images of the oblique angle deposition show a porous surface similar to that of normally deposited aluminum on the same substrate. The surface of the oblique angle deposition had no substantial measurement for resistance. It optically exhibited transparency at normal viewing, opacity at oblique viewing. No prominent peaks were observed in its reflectance test.