Minimizing buckles on the surface of thin films on elastomeric substrates using oblique angle deposition

Abstract

Copper thin films were deposited on elastomeric grating substrates. Microscope images of the sample produced through conventional thermal evaporation show buckling on the surface as a result of the compressive stresses that developed in the deposition process. The obliquely deposited samples showed minimal buckling as a result of the columnar nanostructures that result from oblique angle deposition. Atomic force microscope (AFM) images confirm the presence of this columnar nanostructure on the film produced through oblique angle deposition.