Electrophoretic deposited YBa2Cu3O7-δ films
Abstract
YBa2Cu3O7-δ films, fabricated via solid state reaction, were successfully deposited unto Copper sheet by electrophoretic deposition technique (EPD). The EPD solutions were prepared by suspending 0.3 gram of YBCO powders in 30mL acetone with addition of 0.006 gram of Iodine. The surface morphology of the as-deposited films was studied via Scanning Electron Microscopy (SEM). Probability Distribution Function (PDF) and Cumulative Distribution Function (CDF) curves as a function of grain size were obtained through image processing of the SEM images. The dependence of grain size distribution on different EPD parameters namely voltage, concentration, electrode distance, and iodine addition were studied.