Effect of sputtering gas ratio and post-annealing parameters on AlN thin films deposited via low power RF magnetron sputtering

Authors

  • Roni Andig National Institute of Physics, University of the Philippines Diliman
  • Mae Agatha Tumanguil Materials Science and Engineering Program, University of the Philippines Diliman
  • John Paul Ferrolino Materials Science and Engineering Program, University of the Philippines Diliman
  • Earl Conan Casalme Materials Science and Engineering Program, University of the Philippines Diliman
  • Joy Kristelle De Mata Materials Science and Engineering Program, University of the Philippines Diliman
  • Arnel Salvador National Institute of Physics, University of the Philippines Diliman

Abstract

This work explores the deposition of aluminum nitride (AlN) using a low-power RF magnetron sputtering system. The X-ray diffraction analysis (XRD) pattern of the fabricated sample shows peaks representing AlN (001) and (002) crystal orientation at 33.25° and 36.09°. There was a noticeable peak shift when the samples were annealed to 1000°C owing to a more crystalline sample. However, the deposited thin films still have low crystallinity and the parameters used can still be further optimized.

Downloads

Issue

Article ID

SPP-2023-PA-34

Section

Poster Session A (Materials Science, Instrumentation, and Photonics)

Published

2023-07-14

How to Cite

[1]
R Andig, MA Tumanguil, JP Ferrolino, EC Casalme, JK De Mata, and A Salvador, Effect of sputtering gas ratio and post-annealing parameters on AlN thin films deposited via low power RF magnetron sputtering, Proceedings of the Samahang Pisika ng Pilipinas 41, SPP-2023-PA-34 (2023). URL: https://proceedings.spp-online.org/article/view/SPP-2023-PA-34.