Copper thin films on plasma-treated glass substrates

Authors

Paz Victoria T. Ramos ⋅ PH Department of Physics, Ateneo de Manila University and College of Development Communication and Arts & Sciences, Isabela State University
Artoni Kevin Ang ⋅ PH Department of Physics, Ateneo de Manila University
Ivan B. Culaba ⋅ PH Department of Physics, Ateneo de Manila University

Abstract

A vacuum coating system for thermal evaporation was reconfigured to include a DC glow discharge system for plasma bombardment of substrates before the deposition process. Cu films were deposited onto glass substrates using this modified coating system. The glass substrates where exposed to argon plasma discharge for ten minutes before copper metallization, without breaking the vacuum. It was observed that less surface imperfections and higher adhesion were manifested by the Cu films on plasma-treated glass substrates as compared to glass substrates which did not undergo plasma treatment. Higher percent transmission was achieved for thermally evaporated Cu film of 16.32% compared to PAD samples of 9.72%,7.315 and 11.35%, respectively at around 566-570nm.

Downloads

Issue

2010: Proceedings of the 28th Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2010-PA-45

Section

Poster Session PA

Published

2010-10-25

How to Cite

[1]

PVT Ramos, AK Ang, and IB Culaba, Copper thin films on plasma-treated glass substrates, Proceedings of the Samahang Pisika ng Pilipinas 28, SPP-2010-PA-45 (2010). URL: https://proceedings.spp-online.org/article/view/SPP-2010-PA-45.