Electrical characterization of surface modified epoxy-silica nanocomposites
Abstract
Resistivity and dielectric constant measurements were performed for nanocomposites with methacryl-based surface modified silica filler (R711), octyl-based surface modified silica filler (R805), and unmodified silica filler. R711 had an initial decrease in resistivity up to 1%wt, wherein it increased thereupon. Increased resistivity was observed at increasing %wt of R805. Irregular resistivity behavior was observed for those with unmodified silica. Logarithmic dependence of composite dielectric constant to filler quantity was confirmed at low concentrations. These results show that the epoxy-silica nanocomposite with octyl-based surface modified filler at 0.2% is best suited for plastic packaging applications.