Fabrication and characterization of interdigitated capacitors for MMIC applications
Abstract
Planar interdigitated capacitors (IDCs) for GaAs based microwave monolithic integrated circuit (MMIC) applications were successfully fabricated using standard fabrication process. Electroplating was also used to have thicker Au metal conductor strips of the IDCs. The two fabricated IDCs have the same fingers width (w=10um) and length (L=500um) but differ in number of metal fingers (N1=26 & N2=9) and spacing between fingers (S1=10um & S2=45um). Measured capacitances and Q-factors for IDC with N=26 is 1.2pF and Q=9 at 550MHz while for N=9 the capacitance is 0.6031pF and Q=16 at 300MHz.