A study on the integration of multi-walled carbon nanotube in a multi-aromatic epoxy mold compound for microelectronics application

Authors

Baltazar Canete ⋅ PH School of Graduate Studies, Mapúa Institute of Technology and NXP Semiconductors Philippines, Inc., Laguna
Adrian Casano ⋅ PH School of Graduate Studies, Mapúa Institute of Technology
Adrian Cortez ⋅ PH School of Graduate Studies, Mapúa Institute of Technology
Christian Lucas ⋅ PH School of Graduate Studies, Mapúa Institute of Technology
Jerwin Separa ⋅ PH School of Graduate Studies, Mapúa Institute of Technology
Oliver Bryan Manibog ⋅ PH School of Graduate Studies, Mapúa Institute of Technology
Blessie A. Basilia ⋅ PH School of Graduate Studies, Mapúa Institute of Technology

Abstract

As the electronics industry continues to develop smaller and slimmer portable devices, manufacturers have been challenged to find new ways to combat the persistent problem of thermal management. New findings suggest that carbon nanotubes may soon be integrated into ever-shrinking cell phones, digital audio players, and personal digital assistants to help ensure the equipment does not overheat, malfunction, or fail. This study aims to determine the effect of CNT loading on the mechanical, thermal and microstructure properties of multi-aromatic epoxy molding compound (EMC) used by the microelectronics industry. Multi-walled carbon nanotube (MWCNT) used in this study has a diameter of 10-15 nm and the purity is over 95%. Various loading of MWCNT in the EMC matrix was conducted at concentrations of 0.1%, 0.25%, 5% and 9% MWCNT. The glass transition (Tg) of the samples was determined by Differential Scanning Calorimetry (DSC) from 30°C to 270°C and the viscoelastic properties was studied by using a Dynamic Mechanical Analyzer (DMA).
The fractured surfaces of the samples were examined using a Scanning Electron Microscope (SEM). Results of the study show that as the MWCNT loading increases, the Tg of the samples decreases which indicate better processability of EMC with CNT impregnation. It was also observed that the addition of MWCNT makes the EMC tougher compared with the pure sample and this behavior was enhanced as the loading increases. The SEM micrographs show that the MWCNT tends to agglomerate as the concentration increases. Strong Van der Waals forces on the nanometer-sized particles cause the agglomeration of the MWCNT.
A Finite Element Analysis (FEA) was carried out to predict the impact of the MWCNT-loaded EMC on the thermo-mechanical reliability of the electronic assembly.

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Issue

2007: Proceedings of the 25th Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2007-PB-16

Section

Poster Session PB

Published

2007-10-24

How to Cite

[1]

B Canete, A Casano, A Cortez, C Lucas, J Separa, OB Manibog, and BA Basilia, A study on the integration of multi-walled carbon nanotube in a multi-aromatic epoxy mold compound for microelectronics application, Proceedings of the Samahang Pisika ng Pilipinas 25, SPP-2007-PB-16 (2007). URL: https://proceedings.spp-online.org/article/view/SPP-2007-PB-16.