Growth of a multilayer dielectric stack via Plasma Enhanced Chemical Vapor Deposition
Abstract
A multilayer dielectric stack was grown via Plasma Enhanced Chemical Vapor Deposition (PECVD) using SiH4, N2 and N2O gases. Six pairs of alternating layers of SixNy/SiO2 were deposited on an n-type Silicon substrate. The deposition temperature, pressure and RF power are 350°C, 9 x 10−1mbar and 100 W, respectively. The multilayers are designed to reflect in the infrared wavelength. Analysis of the grown multilayer was done using a phase modulated spectroscopic ellipsometry (SE) in reflection mode. Results show that the grown multilayer dielectric stack exhibit high reflectivity centered at 840 nm when observed at an angle of 45°. This shows an 11.25% deviation from the designed multilayer center wavelength.