Curing kinetics of a semiconductor phenol-based epoxy cresol novolac mold compound via differential scanning calorimetry

Authors

  • Ian Harvey J. Arellano Institute of Chemistry, University of the Philippines Diliman
  • Francesca N. Beltran Institute of Chemistry, University of the Philippines Diliman
  • Marlon T. Conato Institute of Chemistry, University of the Philippines Diliman
  • Florentino Sumera Institute of Chemistry, University of the Philippines Diliman

Abstract

The cure kinetics of a semiconductor grade epoxy molding compound that is of epoxy cresol novolac (ECN) resin type with phenol novolac as its curing agent were investigated using differential scanning calorimeter under isothermal and dynamic modes. The reaction was analyzed using an nth order kinetic model for both exposed and unexposed samples. The order and rate constant of the cure reaction were quantitatively determined using Borchardt and Daniels, Kissinger and Ozawa, and isothermal methods and were found to be 1.6736 and 0.09628 s−1 for the exposed and 1.3381 and 0.1110 s−1 for the unexposed samples, respectively. The activation energy and the Arrhenius constant were found to be 117.77 kJ⋅mol−1 and 2.396 x 1014 for the exposed and 136.75 kJ⋅mol−1 and 4.431 x 1016 for the unexposed samples, respectively.

SPP 2007 Proceedings Cover

Downloads

Published

2007-10-24

Issue

2007: Proceedings of the 25th Samahang Pisika ng Pilipinas Physics Congress

Section

Condensed Matter Physics

License

By submitting their manuscript to the Samahang Pisika ng Pilipinas (SPP) for consideration, the Authors warrant that their work is original, does not infringe on existing copyrights, and is not under active consideration for publication elsewhere.
Upon acceptance of their manuscript, the Authors further agree to grant SPP the non-exclusive, worldwide, and royalty-free rights to record, edit, copy, reproduce, publish, distribute, and use all or part of the manuscript for any purpose, in any media now existing or developed in the future, either individually or as part of a collection.
All other associated economic and moral rights as granted by the Intellectual Property Code of the Philippines are maintained by the Authors.

How to Cite

[1]
“Curing kinetics of a semiconductor phenol-based epoxy cresol novolac mold compound via differential scanning calorimetry”, Proc. SPP, vol. 25, no. 1, pp. SPP–2007, Oct. 2007, Accessed: Mar. 26, 2026. [Online]. Available: https://proceedings.spp-online.org/article/view/SPP-2007-1D-05