Curing kinetics of a semiconductor phenol-based epoxy cresol novolac mold compound via differential scanning calorimetry

Authors

Ian Harvey J. Arellano ⋅ PH Institute of Chemistry, University of the Philippines Diliman
Francesca N. Beltran ⋅ PH Institute of Chemistry, University of the Philippines Diliman
Marlon T. Conato ⋅ PH Institute of Chemistry, University of the Philippines Diliman
Florentino Sumera ⋅ PH Institute of Chemistry, University of the Philippines Diliman

Abstract

The cure kinetics of a semiconductor grade epoxy molding compound that is of epoxy cresol novolac (ECN) resin type with phenol novolac as its curing agent were investigated using differential scanning calorimeter under isothermal and dynamic modes. The reaction was analyzed using an n^th order kinetic model for both exposed and unexposed samples. The order and rate constant of the cure reaction were quantitatively determined using Borchardt and Daniels, Kissinger and Ozawa, and isothermal methods and were found to be 1.6736 and 0.09628 s⁻¹ for the exposed and 1.3381 and 0.1110 s⁻¹ for the unexposed samples, respectively. The activation energy and the Arrhenius constant were found to be 117.77 kJ⋅mol⁻¹ and 2.396 x 10¹⁴ for the exposed and 136.75 kJ⋅mol⁻¹ and 4.431 x 10¹⁶ for the unexposed samples, respectively.

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Issue

2007: Proceedings of the 25th Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2007-1D-05

Section

Condensed Matter Physics

Published

2007-10-24

How to Cite

[1]

IHJ Arellano, FN Beltran, MT Conato, and F Sumera, Curing kinetics of a semiconductor phenol-based epoxy cresol novolac mold compound via differential scanning calorimetry, Proceedings of the Samahang Pisika ng Pilipinas 25, SPP-2007-1D-05 (2007). URL: https://proceedings.spp-online.org/article/view/SPP-2007-1D-05.