Reactive ion etching of plasma-grown thin films
Abstract
Reactive ion etching of GaAs substrates with plasma-deposited Silicon Nitride (SixNy) and Silicon Dioxide (SiO2) thin films was done through the use of a modified Fluorine-based RIE setup. Resist stripe and spiral patterns were used to determine the feasibility of CHF3/O2 etching of plasma-grown thin films using the set-up. Successful etching of the plasma-deposited layers shows the viability of using the modified set-up for further applications in surface cleaning and etching.