Effect of annealing on the resistivity of Au plated Kovar lead frames

Authors

Gay Kathrina P. Maniquiz Materials Science and Engineering Program, University of the Philippines Diliman
Carlo Magno D. Reyes Materials Science and Engineering Program, University of the Philippines Diliman
Roland V. Sarmago National Institute of Physics, University of the Philippines Diliman

Abstract

This paper studies the effect of annealing on Au plated Kovar lead frames. The results show that annealing at 600°C lowered the resistance of Au plated Kovar from 0.4947 Ω to 0.405 Ω. This is due to the fact that annealing relieved residual stresses from gold sputtering and consequently promoted grain growth in the material. However, annealing at a higher temperature of 700°C caused grooving of grain boundaries, which eventually lead to film rupture thus a higher resistance value of 2.3237 Ω for the material. Results showed that further annealing would affect the stability of electrical performance of the solder material. Therefore, there is just a sufficient amount of temperature by which the solder material can withstand and can still be electrically stable. Consequently, the value obtained at higher annealing temperature is also higher from the resistance obtained from the currently employed SnAu plating, which is 1.114 Ω.

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Issue

2005: Proceedings of the 23rd Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2005-PA-29

Section

Poster Session PA

Published

2005-10-26

How to Cite

[1]

GKP Maniquiz, CMD Reyes, and RV Sarmago, Effect of annealing on the resistivity of Au plated Kovar lead frames, Proceedings of the Samahang Pisika ng Pilipinas 23, SPP-2005-PA-29 (2005). URL: https://proceedings.spp-online.org/article/view/SPP-2005-PA-29.