High contrast component discrimination and failure localization in integrated circuits using spectral reflectance microscopy

Authors

Godofredo Bautista National Institute of Physics, University of the Philippines Diliman
Serafin Delica National Institute of Physics, University of the Philippines Diliman
Carlo Mar Blanca National Institute of Physics, University of the Philippines Diliman
Bernardino Buenaobra National Institute of Physics, University of the Philippines Diliman
Caesar A. Saloma National Institute of Physics, University of the Philippines Diliman

Abstract

We demonstrate a simple, 1D-scanning, low-cost spectral reflectance microscope that delivers high contrast images of the temperature variations caused by photoinduced currents and thermally-generated free carriers in an integrated circuit (IC). Application of the technique revealed strong spectral discrimination between IC components even within the semiconducting material itself. Moreover, the use of a broadband, visible light source permits one to visualize the localization of heating and cooling regions in an integrated circuit thru its change in reflectance map. In this way, specific sample positions can be probed simply by optimizing illumination that gives a high thermoreflectance signal paving the way for faster and more efficient thermal validation.

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Issue

2005: Proceedings of the 23rd Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2005-3A-02

Section

Instrumentation and Optics

Published

2005-10-26

How to Cite

[1]

G Bautista, S Delica, CM Blanca, B Buenaobra, and CA Saloma, High contrast component discrimination and failure localization in integrated circuits using spectral reflectance microscopy, Proceedings of the Samahang Pisika ng Pilipinas 23, SPP-2005-3A-02 (2005). URL: https://proceedings.spp-online.org/article/view/SPP-2005-3A-02.