High contrast component discrimination and failure localization in integrated circuits using spectral reflectance microscopy
Abstract
We demonstrate a simple, 1D-scanning, low-cost spectral reflectance microscope that delivers high contrast images of the temperature variations caused by photoinduced currents and thermally-generated free carriers in an integrated circuit (IC). Application of the technique revealed strong spectral discrimination between IC components even within the semiconducting material itself. Moreover, the use of a broadband, visible light source permits one to visualize the localization of heating and cooling regions in an integrated circuit thru its change in reflectance map. In this way, specific sample positions can be probed simply by optimizing illumination that gives a high thermoreflectance signal paving the way for faster and more efficient thermal validation.