The effect of thermal cycle on electrical performance of SnAu and Sn solders plated on Kovar leadframe

Authors

Winston G. Mutia ⋅ PH Materials Science and Engineering Program, University of the Philippines Diliman
Melanie Baligod ⋅ PH Materials Science and Engineering Program, University of the Philippines Diliman
Roland V. Sarmago ⋅ PH National Institute of Physics, University of the Philippines Diliman

Abstract

Stability of electrical performance is highly dependent on reliability of solder alloy used in package level and board level interconnects. Solder materials are expected to change metallurgically after extended use which will eventually lead to failure caused by opens or high electrical resistance. This study will investigate the effect of 10x and 20x thermal cycles to electrical performance of SnAu and Sn solder as alternative to SnPb solder. SnAu and Sn were plated on kovar leadframes and I-V curves were measured prior and after subjecting the samples to thermal cycles. Results show that both SnAu and Sn solders indicate very minimal change in electrical performance after 10x, but a significant change is observed after 20x of thermal cycle. Surface morphology analysis shows that grain distortions and crystals strains appeared after 20x. I-V measurements and SEM analysis proves that the results conforms to the known theory regarding the alteration of resistance due to strain induced during thermal cycling.

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Issue

2005: Proceedings of the 23rd Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2005-2F-03

Section

Materials Science

Published

2005-10-26

How to Cite

[1]

WG Mutia, M Baligod, and RV Sarmago, The effect of thermal cycle on electrical performance of SnAu and Sn solders plated on Kovar leadframe, Proceedings of the Samahang Pisika ng Pilipinas 23, SPP-2005-2F-03 (2005). URL: https://proceedings.spp-online.org/article/view/SPP-2005-2F-03.