Infrared emission spectral imaging and its application in failure analysis

Authors

Michelle F. Bailon Intel Technology Philippines, Inc.
Alvarado B. Tarun Intel Technology Philippines, Inc.
Maricor Soriano National Institute of Physics, University of the Philippines Diliman
Caesar Saloma National Institute of Physics, University of the Philippines Diliman

Abstract

In this paper, we present the emission spectral imaging capability that we have developed for the Infrared Emission Microscope (IREM) tool. This innovative technique can provide fundamental physical information on the nature of emissions in device structures and can also be applied for "defect finger-printing." It can also be use for quick and accurate detection and identification of discrete nanometer sized elements in multi-level integrated circuits.
The emission spectrum of a structure in an IC is derived from images using four different spectral band filters in the 800-1500 nm range. Singular Value Decomposition (SVD) is utilized to calculate the spectrum of a structure with respect to a spectral library. Here, we will present the technique and its advantages over existing IREM spectral systems, then we will show how it is utilized in solving a failure analysis (FA) case.

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Issue

2004: Proceedings of the 22nd Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2004-PA-15

Section

Poster Session PA

Published

2004-10-25

How to Cite

[1]

MF Bailon, AB Tarun, M Soriano, and C Saloma, Infrared emission spectral imaging and its application in failure analysis, Proceedings of the Samahang Pisika ng Pilipinas 22, SPP-2004-PA-15 (2004). URL: https://proceedings.spp-online.org/article/view/SPP-2004-PA-15.