Infrared emission spectral imaging and its application in failure analysis
Abstract
In this paper, we present the emission spectral imaging capability that we have developed for the Infrared Emission Microscope (IREM) tool. This innovative technique can provide fundamental physical information on the nature of emissions in device structures and can also be applied for "defect finger-printing." It can also be use for quick and accurate detection and identification of discrete nanometer sized elements in multi-level integrated circuits.
The emission spectrum of a structure in an IC is derived from images using four different spectral band filters in the 800-1500 nm range. Singular Value Decomposition (SVD) is utilized to calculate the spectrum of a structure with respect to a spectral library. Here, we will present the technique and its advantages over existing IREM spectral systems, then we will show how it is utilized in solving a failure analysis (FA) case.