Polymers: Fundamentals and applications to semiconductor packaging

Abstract

Polymers are an important raw material for majority of semiconductor packaging. It usually comes in the form of die attach epoxy and epoxy encapsulation. This workshop will review the important parameters that affect the physical and chemical properties of polymer (and its compounds). These properties are then linked to the device performance, and eventually to failure modes. Finally, such an understanding between polymer properties and failure modes can lead to an optimum process conditions.