Infrared emission spectroscopy: How it can be used in Failure Analysis
Abstract
In this paper, we present the emission spectral analysis capability, currently being developed for the Infrared Emission Microscope (IREM) tool. This innovative technique can provide fundamental physical information on the nature of emissions in device structures and can also be applied for "defect-fingerprinting." We discuss how definitive spectral measurements on various Si-devices are carried out to build a spectral library. We also present how spectral analysis is performed on "thermally-stressed" n-channel transistors and how they are distinguished from normal n-channel transistors.