Infrared emission spectroscopy: How it can be used in Failure Analysis

Authors

Michelle F. Bailon Quality and Reliability Department, Intel Technology Philippines, Inc.
Alvarado Tarun Quality and Reliability Department, Intel Technology Philippines, Inc.
Wilma Oblefias National Institute of Physics, University of the Philippines Diliman
Elmer Estacio National Institute of Physics, University of the Philippines Diliman
Maricor Soriano National Institute of Physics, University of the Philippines Diliman
Caesar Saloma National Institute of Physics, University of the Philippines Diliman

Abstract

In this paper, we present the emission spectral analysis capability, currently being developed for the Infrared Emission Microscope (IREM) tool. This innovative technique can provide fundamental physical information on the nature of emissions in device structures and can also be applied for "defect-fingerprinting." We discuss how definitive spectral measurements on various Si-devices are carried out to build a spectral library. We also present how spectral analysis is performed on "thermally-stressed" n-channel transistors and how they are distinguished from normal n-channel transistors.

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Issue

2003: Proceedings of the 21st Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2003-PS-05

Section

Plenary Sessions

Published

2003-10-22

How to Cite

[1]

MF Bailon, A Tarun, W Oblefias, E Estacio, M Soriano, and C Saloma, Infrared emission spectroscopy: How it can be used in Failure Analysis, Proceedings of the Samahang Pisika ng Pilipinas 21, SPP-2003-PS-05 (2003). URL: https://proceedings.spp-online.org/article/view/SPP-2003-PS-05.