Surface profiling of silicon wafers using digital speckle pattern interferometry (DSPI)

Authors

Percival F. Almoro National Institute of Physics, University of the Philippines Diliman
Paul Eric B. Parañal National Institute of Physics, University of the Philippines Diliman
Marlon Rosendo H. Daza National Institute of Physics, University of the Philippines Diliman

Abstract

We demonstrate that digital speckle pattern interferometry (DSPI) allows fast and sensitive measurement of three-dimensional (3D) surface depth profiles at sub-micron scales. By using a ground plate (GP) as a speckle source, we have extended the application of DSPI to mirror-like objects. Here we measure and visualize the 3D profiles of silicon wafer dies using DSPI and phase-unwrapping algorithms. DSPI is compared with a commercially available surface profiling module and the advantages of DSPI, in terms of sensitivity and speed, are clearly seen.

Downloads

Issue

2002: Proceedings of the 20th Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2002-PP-31

Section

Instrumentation and Optics

Published

2002-10-23

How to Cite

[1]

PF Almoro, PEB Parañal, and MRH Daza, Surface profiling of silicon wafers using digital speckle pattern interferometry (DSPI), Proceedings of the Samahang Pisika ng Pilipinas 20, SPP-2002-PP-31 (2002). URL: https://proceedings.spp-online.org/article/view/SPP-2002-PP-31.