Surface profiling of silicon wafers using digital speckle pattern interferometry (DSPI)

Authors

Percival F. Almoro ⋅ PH National Institute of Physics, University of the Philippines Diliman
Paul Eric B. Parañal ⋅ PH National Institute of Physics, University of the Philippines Diliman
Marlon Rosendo H. Daza ⋅ PH National Institute of Physics, University of the Philippines Diliman

Abstract

We demonstrate that digital speckle pattern interferometry (DSPI) allows fast and sensitive measurement of three-dimensional (3D) surface depth profiles at sub-micron scales. By using a ground plate (GP) as a speckle source, we have extended the application of DSPI to mirror-like objects. Here we measure and visualize the 3D profiles of silicon wafer dies using DSPI and phase-unwrapping algorithms. DSPI is compared with a commercially available surface profiling module and the advantages of DSPI, in terms of sensitivity and speed, are clearly seen.

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Issue

2002: Proceedings of the 20th Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2002-PP-31

Section

Instrumentation and Optics

Published

2002-10-23

How to Cite

[1]

PF Almoro, PEB Parañal, and MRH Daza, Surface profiling of silicon wafers using digital speckle pattern interferometry (DSPI), Proceedings of the Samahang Pisika ng Pilipinas 20, SPP-2002-PP-31 (2002). URL: https://proceedings.spp-online.org/article/view/SPP-2002-PP-31.