Liquid phase epitaxy of Sn-doped GaAs
Abstract
Semiconductor devices, in particular p-n junctions are realized by successive deposition of p-AlxGa1-xAs and n-GaAs on undoped GaAs substrates. In order to fabricate p-n junctions that exhibit good electrical and optical qualities, optimization of the growth parameters and melt composition to obtain the desired net carrier concentration in the grown p-type and n-type layers is necessary.
Among the n-type dopants, tin (Sn) exhibits the lowest volatility as deduced from the fact that it only exerts a pressure of 760 mmHg at a temperature of 2270°C. This minimizes problems regarding the loss of the dopant during epitaxial growth. Hence, Sn is very attractive for n-type doping in LPE grown GaAs and AlxGa1-xAs.
This paper reports on the structural and electrical properties of Sn-doped GaAs with specific emphasis on their dependence on the atomic fraction of Sn in the melt.