Solderability implications of burn-in on side-brazed packages
Abstract
Devices for military applications undergo accelerated operating life stressing or "Burn-In (BI)" prior to final testing. Ceramic Dual In-Line Packages (CD) have one less test manufacturing step since its leads (or terminations) are dipped in solder prior to BI. In a move toward reducing device handling and improving cycle time, an attempt was made to emulate the CERDIP procedure to Side Brazed (SB) and Metal Can (MC) packages. Initial runs show both SB and MC's shiny solder finish became rough and dull and failed a standard Solderability test after BI. An examination of the leads showed SB and MC differ from CD in that it has an additional Nickel-layer on top of the base metal. This paper aims to determine how the additional layer of Ni in SB (and MC) induced a rough surface morphology and caused Solderability test failures.
Downloads
Published
Issue
Section
License
By submitting their manuscript to the Samahang Pisika ng Pilipinas (SPP) for consideration, the Authors warrant that their work is original, does not infringe on existing copyrights, and is not under active consideration for publication elsewhere.
Upon acceptance of their manuscript, the Authors further agree to grant SPP the non-exclusive, worldwide, and royalty-free rights to record, edit, copy, reproduce, publish, distribute, and use all or part of the manuscript for any purpose, in any media now existing or developed in the future, either individually or as part of a collection.
All other associated economic and moral rights as granted by the Intellectual Property Code of the Philippines are maintained by the Authors.
