Sputtered aluminum film on copper substrate: Investigation on the growth kinetics, intrinsic stress, and interfacial bonding

Authors

Alipio T. Garcia ⋅ PH Department of Physics, University of the Philippines College of Baguio
Armando S. Somintac ⋅ PH National Institute of Physics, University of the Philippines Diliman
Paul Eric Parañal ⋅ PH National Institute of Physics, University of the Philippines Diliman
Roland V. Sarmago ⋅ PH National Institute of Physics, University of the Philippines Diliman

Abstract

For modest applications in electronic devices where copper and aluminum are the metals of choice, the problem of providing thermal barrier coating (TBC) on metallic Al or Cu substrate is presently addressed in this investigation. Using copper substrates, this study aims to explore the feasibility of depositing ceramic-TBC using sputtering, an old but hitherto untested method in such an application where the usual processing methods are thermal spray, powder processing, chemical vapor deposition, and combustion synthesis. With the final objective of growing ceramic layer on metallic substrate in mind, this paper reports the results of a preliminary investigation involving the growth of aluminum films on copper substrates: its interface bonding, surface, and intrinsic stresses.
Experimental data show that films grown at 300-500°C exhibit the best (almost crack-free) surfaces, least stresses, and good interfacial bonding. These films stand the least amount of risk of spallation during thermal cycling, making them the best base layer for the subsequent growth of a thermal barrier coat which is a ceramic material, in this case alumina.

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Issue

1997: Proceedings of the 15th National Physics Congress of the Samahang Pisika ng Pilipinas

Article ID

SPP-1997-CM-06

Section

Condensed Matter Physics and Materials Science

Published

1997-10-27

How to Cite

[1]

AT Garcia, AS Somintac, PE Parañal, and RV Sarmago, Sputtered aluminum film on copper substrate: Investigation on the growth kinetics, intrinsic stress, and interfacial bonding, Proceedings of the Samahang Pisika ng Pilipinas 15, SPP-1997-CM-06 (1997). URL: https://proceedings.spp-online.org/article/view/SPP-1997-CM-06.