Evaluation on the applicability of fringe projection profilometry in warpage measurement of semiconductor packages

Authors

Angelie B. Palarion ⋅ PH Department of Physics, University of San Carlos
Mary Ann Rendon ⋅ PH Department of Physics, University of San Carlos
Oliver Semblante ⋅ PH Department of Physics, University of San Carlos
Regine Loberternos ⋅ PH Department of Physics, University of San Carlos
Claude Ceniza ⋅ PH Department of Physics, University of San Carlos
Michael Lawrence Castañares ⋅ PH Department of Physics, University of San Carlos
Francis Tallo ⋅ PH Bank of the Philippines Islands
Renante Violanda ⋅ PH Department of Physics, University of San Carlos
Erwin Victor Cruz ⋅ PH Fairchild Semiconductors Philippines, Inc.
Raymund Sarmiento ⋅ PH Department of Physics, University of San Carlos

Abstract

Fringe projection profilometry (FPP), a non-contact measurement method, was utilized to measure the out of plane deformation of small-scale semiconductor packages. The experimental set-up consists of an image acquisition system and an image projection system. Warpage measurements and the surface profile of the object-of-interest were obtained by projecting fringe patterns over the surface of the semiconductor package sample. The surface profile of the object was obtained but modulations present on the obtained surface profile. It was found that decreasing the wavelength of the fringe patterns did not necessarily increase the accuracy of the technique as limited by the set-up itself.

Downloads

Issue

2015: Proceedings of the 33rd Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2015-PB-27

Section

Poster Session PB

Published

2015-06-03

How to Cite

[1]

AB Palarion, MA Rendon, O Semblante, R Loberternos, C Ceniza, ML Castañares, F Tallo, R Violanda, EV Cruz, and R Sarmiento, Evaluation on the applicability of fringe projection profilometry in warpage measurement of semiconductor packages, Proceedings of the Samahang Pisika ng Pilipinas 33, SPP-2015-PB-27 (2015). URL: https://proceedings.spp-online.org/article/view/1233.