Optimization of solderability of copper sheet with Sn-Ag-Cu alloy by variations of atmospheric microwave plasma jet (AMPJ) parameters

Authors

Joey Kim T. Soriano National Institute of Physics, University of the Philippines Diliman
Michael Andrei C. Paguio National Institute of Physics, University of the Philippines Diliman
Leo Mendel D. Rosario National Institute of Physics, University of the Philippines Diliman
Henry Ramos National Institute of Physics, University of the Philippines Diliman
Roy Tumlos National Institute of Physics, University of the Philippines Diliman

Abstract

This study used response surface methodology (RSM) to optimize solderability property of copper by variations of atmospheric microwave plasma jet (AMPJ) parameters. Tensile force of adhesion, the main indicator of solderability property, was maximized while minimizing the microwave power, air/Ar flow rate ratio and treatment time. The generated model indicates significant effect (p<0.05) of microwave power, air/Ar flow rate ratio and treatment time to the tensile force. The optimum AMJP parameters of 300 W microwave power, 0.17 air/Ar flow rate ratio and 20.14 seconds treatment time generated a 3.4% error of the predicted tensile force of adhesion compared to the experimental value.

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Issue

2015: Proceedings of the 33rd Samahang Pisika ng Pilipinas Physics Congress

Article ID

SPP-2015-4B-06

Section

Instrumentation and Plasma Physics

Published

2015-06-03

How to Cite

[1]

JKT Soriano, MAC Paguio, LMD Rosario, H Ramos, and R Tumlos, Optimization of solderability of copper sheet with Sn-Ag-Cu alloy by variations of atmospheric microwave plasma jet (AMPJ) parameters, Proceedings of the Samahang Pisika ng Pilipinas 33, SPP-2015-4B-06 (2015). URL: https://proceedings.spp-online.org/article/view/1121.