[1]
Arellano, I.H.J., Beltran, F.N., Conato, M.T. and Sumera, F. 2007. Curing kinetics of a semiconductor phenol-based epoxy cresol novolac mold compound via differential scanning calorimetry. Proceedings of the Samahang Pisika ng Pilipinas, 25(1), SPP-2007-1D-05. URL: https://proceedings.spp-online.org/article/view/SPP-2007-1D-05.