[1]
Palarion, A.B., Rendon, M.A., Semblante, O., Loberternos, R., Ceniza, C., CastaƱares, M.L., Tallo, F., Violanda, R., Cruz, E.V. and Sarmiento, R. 2015. Evaluation on the applicability of fringe projection profilometry in warpage measurement of semiconductor packages. Proceedings of the Samahang Pisika ng Pilipinas, 33(1), SPP-2015-PB-27. URL: https://proceedings.spp-online.org/article/view/1233.